Jack Harding, Chairman, President and CEO
eSilicon Corporation
Current Affiliations:
Currently on the Board of Directors of RF Micro Devices (NASDAQ: RFMD) and Global Semiconductor Alliance (GSA) in addition to being the Chairman of eSilicon Corporation
Background:
Jack Harding is president and CEO of eSilicon Corporation and brings more than 25 years of management experience spanning the semiconductor and EDA sectors. Mr. Harding co-founded eSilicon in 2000 and is responsible for eSilicon overall leadership, strategy and management. Several years ago, Mr. Harding introduced a new business model called the Value Chain Producer (VCP) that is today a $1B market segment.
As a GSA board member over the past three years, Mr. Harding worked diligently on the finance committee and guided the GSA and its membership through turbulent economic times ensuring that there was no loss in member benefits or focus on important programs. He has also served as a key spokesperson for GSA. He is a frequent international speaker on the topics of innovation, entrepreneurship and semiconductor trends and policies.
Prior to eSilicon, he served as president and CEO of Cadence during which time Cadence achieved the status of world’s largest supplier of EDA software and provided the greatest shareholder value in the history of that company. Mr. Harding entered Cadence upon the acquisition of Cooper & Chyan Technology (CCT), where he served as the president and CEO, and was responsible for leading the company to an IPO. Prior to CCT, Mr. Harding served as the executive vice president of Zycad Corporation. Mr. Harding began his career at IBM.
Education:
He holds a B.A. from Drew University in Chemistry and Economics and attended the Stern School of Business at New
York University.
